About Motorola Solutions

Contact Information:

Steve Spanoudis
Mobile: 001-954-605-7716

Mailing Address:

Motorola Rapid Prototyping Services, 4J9
Motorola Solutions, Inc.
8000 West Sunrise Blvd.
Plantation, FL 33322-9947

Follow MSI on the New York Stock Exchange

Photos, Left to Right: Automated PCB Inspection; Appearance Modeling; Electrical Discharge Machining (EDM)

Industry Events:

International Molding Conference

Rapid / Digital Imaging Conference (SME)

Medical Design & Manufacturing

ANTEC: Annual Technical Conference (SPE)

APMM: Association of Professional Model makers

Internatinal Optical Metrology Conference (Europe)

Internatinal Optical Metrology Conference (Asia)

AMUG: Additive Manufacturing Users Group

IMTS: International Manufacturing Technology Showcase

NPE: National Plastics Exhibition (SPI)

Business Overview

We provide comprehensive mechanical and PC board prototyping services supporting the development of communications, medical, industrial, and consumer products From our location on Motorola Solutions' South Florida Development Campus. We provide Motorola and its business partners with a wide range of services to accelerate product ideation and development, and ensure product quality and reliability. From our main U.S. location we serve both domestic and global demand. Motorola Solutions maintains satellite prototyping capabilities to serve local needs in Penang, Malaysia, in Holtsville, New York, in Copenhagen, Denmark, and in Tel Aviv, Israel.


Our physical prototyping facilities include labs and operational areas for: 3-D printing, appearance modeling, urethane casting, laser etching, decorative finishing and graphics application, CNC milling, EDM wire and EDM die-sinking, mold design, engineering and programming, injection and compression mold tooling, plastics process simulation, and optical metrology. Supporting facilities include custom milling, turning, grinding, metalforming, and associated fabrication processes.

Our Printed Circuit board facilities produce standard multilayer, HDI, and flex circuits, using processes that include lithography, etching, plating, laser and mechanical drilling, lamination, automated optical inspection and automated electrical testing. We use industry standard materials and processes, and offer multiple options for solder mask, nomenclature, and board separation.